Ceiba Technologies

Diamond Tools

Ceiba's Diamond tools offer durability and accuracy by employing the most advanced engineering techniques in diamond sintering and precision processing. The superior diamond particle holding strength minimizes processing contamination and provides high consistency throughout the product’s life. We custom manufacture our tool to satisfy the unique nature of our customer’s applications.

Abrasive
50	# 50 / 60
60	# 60 / 80
80	# 80 / 120
100	# 100 / 120
120	# 120 / 140
140	# 140 / 170
170	# 170 / 200
200	# 200 / 230
230	# 230 / 270
270	# 270 / 325
325	# 325 / 400
400	40 - 60 µm
500	30 - 40 µm
600	23 - 30 µm
800	12 - 25 µm
1,000	10 - 20 µm
1,200	8 - 16 µm
1,500	5 - 12 µm
2,000	3 - 8 µm
2,500	4 - 6 µm
3,000	2 - 6 µm
4,000	2 - 4 µm
5,000	0.5 - 3 µm

Abrasive
Applications	Bond types	Abrasive types

Backgrinding	Electro-Plated	CBN
Dicing	Metal	Natural diamond
Dressing	Resin	Synthetic diamond
Polishing	Vitrified
Custom