Ceiba Technologies manufactures its single sided polishing templates utilizing materials already proven in the industry. We take our carrier materials and polishing pads and bring them together with a highlya reliable adhesive. Our adhesion process has been tested to exceed the shear strength necessary to withstand the forces created by the single sided polishing process. Our base material has extremely consistent physical properties. Thus providing our templates with the capability to polish large diameter wafers. In addition, our template-to-template and lot-to-lot pocket depth variation is minimal due to the reduce stacking tolerances of the different layers.