Ceiba’s diamond wheels offer durability and accuracy by employing the most advanced engineering techniques and precision processing for back grind thinning.

Our particle holding strength minimizes processing contamination and provides high consistency throughout the product’s life with reduced sub-surface damage. A variety of standard offering are available depending on the material to be processed, however we can custom adjust and modify our formulations to satisfy the unique nature of most applications.

Advantages

  • Reduced sub-surface damage
  • Excellent wheel wear characteristics
  • Low heat generation
  • Optimized for shelf sharpening
  • Controlled diamond distribution
  • Consistent removal rates

Common Material Applications

  • Ceramic
  • Hard Alloy
  • Glass
  • Quartz
  • Sapphire
  • Silicon
  • Silicon Carbide

Common Tool Configurations

  • Disco®
  • Okamoto®
  • Strasbaugh®
  • TSK®

Please contact us for additional details.

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