Dicing Blades

Ceiba’s blade technologies are designed and developed for high-precision slicing and dicing of soft to hard materials of many different types and elements, that are used in hard disk drive, optical, and semiconductor applications. Blades are produced with state-of-the-art manufacturing techniques to ensure tightly-controlled dimensional and thickness tolerances.

Offerings include hub and hubless style blades. Our hubless style blades come in a selection of different bond types, ranging from electroformed, metal (sintered), resin, and vitrified.  In addition, Ceiba’s cutting blade diamond compositions and bonds can be customized to best fit your application.

dicing

Electroformed Bond
Hub Blade

Developed for silicon and compound semiconductor wafer cutting.   Proprietary electroforming and diamond distribution processes provide a consistent blade cut quality with reduced backside chipping.

Please contact us for additional details.

Advantages

  • Variety of different grit concentrations
  • Bond hardness adjustability
  • Precise diamond distribution control
  • Blade thicknesses down to 15um available

Applications

Silicon and compound semiconductor wafers

dicing

Electroformed Bond
Hubless Blade

Advanced electroformed manufacturing process capable of producing ultra-thin blades with high strength and stiffness characteristics. Blades keep their shape and provide longer life.

Please contact us for additional details.

Advantages

  • Wide selection of blade options
  • Proprietary thin-blade technology
  • Bond customization options
  • Blade thicknesses down to 25um available

Applications

Ceramics, magnetic materials, PCB, silicon, and etc.

dicing

Metal Bond
Hubless Blade

Formulated sintered metal bond matrix designed to hold and retain diamond grains to increase blade longevity. Blades have a low wear resistance when compared to standard formulations and help to reduce defects such as slanted-kerf.

Please contact us for additional details.

Advantages

  • Wide selection of blade options
  • Special metal bond matrix formulation
  • Excellent rigidity and cut quality
  • Blade thicknesses down to 45um available

Applications

BGA, CSP, optical, sapphire, and etc.

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Resin Bond
Hubless Blade

Resin bond matrix developed to reduce the occurrence of diamond grain deformation and aid in new diamond exposure. Blades provide good cutting efficiency and quality on hard and brittle materials.

Please contact us for additional details.

Advantages

  • Wide selection of blade options
  • Bond matrix allows for high speed processing
  • Improved cut quality on hard materials
  • Blade thicknesses down to 50um available

Applications

Hard and brittle materials, IR filter, optical, QFN, splitter, and etc.

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Vitrified Bond
Hubless Blade

Vitrified bond developed with high rigidity to enhance the straightness of the entry cut and to provide precise cutting during high-loading applications. Blades work well on hard materials, such as crystal and sapphire.

Please contact us for additional details.

Advantages

  • Wide selection of blade options
  • Excellent for high-loading and hard materials
  • Enhanced straight cutting capability
  • Blade thicknesses down to 70um available

Applications

Ceramic, crystal, and sapphire

Please contact us for additional information.