Edge grind wheels are manufactured with tightly distributed fine grade synthetic diamond particles to enable and provide a more consistent wafer-to-wafer edge grind process. Wheels can be tailored to your desired groove dimensions and adjusted to a grit size of up to 3,000 for fine grind applications.

Each groove of the wheel is precisely machined by our EDM (electrical discharge machining) process for strict geometric tolerance control.

​Up to 10 grooves and 2 grit types (rough and fine) can be included into any one wheel. Fine adjusts in hardness and other diamond bond characteristics can be modified for optimization to the end process.

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Advantages

  • Improved surface roughness
  • Increased lifetimes (via Bond characteristics)
  • Tightly controlled diamond distribution
  • Uniform bond structure
  • Highly accurate EDM processing
  • Improved wafer-to-wafer consistency

Common Material Applications

  • Ceramic
  • Gallium Arsenide
  • Gallium Nitride
  • Glass
  • Germanium
  • Sapphire
  • Silicon
  • Silicon Carbide

Common Tool Configurations

  • Daitron®
  • Tosei®

Please contact us for additional details.

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