Edge grind wheels are manufactured with tightly distributed fine grade synthetic diamond particles to enable and provide a more consistent wafer-to-wafer edge grind process. Wheels can be tailored to your desired groove dimensions and adjusted to a grit size of up to 3,000 for fine grind applications.

Each groove of the wheel is precisely machined by our EDM (electrical discharge machining) process for strict geometric tolerance control.

Up to 10 grooves and 2 grit types (rough and fine) can be included into any one wheel. Fine adjusts in hardness and other diamond bond characteristics can be modified for optimization to the end process.


  • Improved surface roughness
  • Increased lifetimes (via Bond characteristics)
  • Tightly controlled diamond distribution
  • Uniform bond structure
  • Highly accurate EDM processing
  • Improved wafer-to-wafer consistency

Common Material Applications

  • Ceramic
  • Gallium Arsenide
  • Gallium Nitride
  • Glass
  • Germanium
  • Sapphire
  • Silicon
  • Silicon Carbide

Common Tool Configurations

  • Daitron®
  • Tosei®

Please contact us for additional details.

Product Availability
Groove Profiles